BCAKLIGHT

The backlight module is one of the key components of the LCD panel
The function is to supply a sufficient light source with a uniform distribution of light so that it can display images properly.


What is COB???


COB:Chip On Board

The chip-on-board package is one of the bare chip mounting technologies, and the semiconductor chip is mounted on the printed circuit board.
The electrical connection between the chip and the substrate is achieved by a wire stitching method and covered with a resin to ensure reliability.

COG: Chip On Glass

What is COG??


  • Under a certain temperature and pressure, the IC Bump is directly aligned with the electrode on the glass substrate, and the ACF is used as the interface material of the bonding, so that the electrodes in the vertical direction of the two bonding objects are turned on.
  • ACF: Anisotropic Conductive Film.


Cleaning / ACF Attachment / COG Preload / COG Pressure / Glue / FOG Pressure / FOG Preload / ACF Attachment / Inspection / Adhesive Tape / Assembly / Inspection / Packaging

COG process flow chart

TAB:Tape Automated Bonding

What is TAB


Under a certain temperature and pressure, the TCP IC is directly aligned with the electrode on the glass substrate, and the ACF is used as the interface material of the bonding, so that the electrodes in the vertical direction of the two bonding objects are turned on.
TCP:Tape Carrier Package
COF:Chip On Film  

SMT:Surface Mount Technology

What is SMT?


Surface assembly technology.
Make the LCD driver IC into a chip package (SMD)
Driving LCD through SMT on PCB